Ceramic DIP

См. также в других словарях:

• Ceramic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …   Wikipédia en Français

• Ceramic Dual Inline Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …   Wikipédia en Français

• Dip-coating — A schematic of the continuous dip coating process. Dip coating is a popular way of creating thin films for research purposes. Uniform films can be applied onto flat or cylindrical substrates. For industrial processes, spin coating is used more… …   Wikipedia

• dip — n. Computing a form of integrated circuit consisting of a small plastic or ceramic slab with two parallel rows of pins. Phrases and idioms: DIP switch an arrangement of switches on a printer for selecting a printing mode. Etymology: abbr. of dual …   Useful english dictionary

• CER-DIP — CERamic Dual In line Package (Academic & Science » Electronics) …   Abbreviations dictionary

• Boîtier DIP — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches …   Wikipédia en Français

• Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

• Типы корпусов процессоров — Содержание 1 Типы корпусов процессоров 1.1 DIP 1.2 QFP 1.3 PLCC/CLCC 1.4 L …   Википедия

• SECC — Содержание 1 Типы корпусов процессоров 1.1 DIP 1.2 QFP 1.3 PLCC/CLCC 1.4 LCC 1.5 PGA …   Википедия

• SECC2 — Содержание 1 Типы корпусов процессоров 1.1 DIP 1.2 QFP 1.3 PLCC/CLCC 1.4 LCC 1.5 PGA …   Википедия

• SPGA — Содержание 1 Типы корпусов процессоров 1.1 DIP 1.2 QFP 1.3 PLCC/CLCC 1.4 LCC 1.5 PGA …   Википедия